The CT-LAMINO is the ultima­tive 3D X‑Ray Inspec­tion System for PCB Assem­blies up to the size of 355mm by 355mm. The latest develo­p­ment of the Fraun­hofer Recon­struc­tion Software will apply.

The CT-LAMINO combines 2D inspec­tion and recon­structed slice by slice inspec­tion of BGA, Flipchip, CSP, and MCM solder joints on single sided as well as on double sided printed circuit boards.

Also 3D views for the third party documen­ta­tion are available. The format of the recon­structed dataset can be imported in most common visua­liz­a­tion software.

The CT-LAMINO is developed for three dimen­sional analysis of compon­ents or solder joints on printed circuit boards or flat outlined products.

The user is interested in defect detection and measu­re­ments in two and three dimen­sional direc­tions. The three dimen­sional Dataset genera­tion is done automa­ti­cally by the CT-LAMINO by collec­ting the off-axis images and recon­struc­ting these to a dataset of 512 by 512 pixels by adjus­table number of slices in depth.

Technical Description

The CT-LAMINO contains three major elements.

  • The X‑Ray tube is located in the bottom of the construc­tion and can move up and down for geometrical magnification.
  • The X and Y table for carrying the specimen and move it to the pre-programmed position very precisely.
  • The Flat Panel Detector, mounted on a X and Y table to generate the obligue views of the pre-defined positions. The distance from the focal Spot of the open tube to the detector is 300mm maximum. The travel length of the tube axes is 100mm. So minimum distance will be 200mm to the detector. The max theore­tical geometrical magni­fi­ca­tion will calculate as: 200mm devided by 2mm is 100 fold. The 2mm is the focal spot distance of 0.25mm plus carbon fiber specimen plate of 1.5mm plus gap of 0.25mm between tube and carbon fiber. From the center of 0 degrees the Detector can move to an angle of max 45 degrees. From there it rotates one full circle and takes 45 degrees off-axis images to a maximum number of 64. In order to make sure the images are always of the same, pre-defined field of view the system software controls the position of the specimen XYtable accord­ingly. After taken the 64 images the reconstruction


  • Indus­trial X‑ray Computed Tomography (CT)
  • 3D volume CT
  • Non-destruc­tive testing (NDT) – 2D and 3D
  • Quality control indepen­dent of material
  • Defect recogni­tion (voids, cracks, …)
  • Conta­ct­less metrology
  • CT recon­struc­tion in real-time
  • Ring artefact suppression
  • Helix CT
  • Easy operation
  • Radiation safety better than 1 µSv/h